Archive:: International Journal of Materials Science and Applications:: Science Publishing Group

Volume 9, Issue 1, January 2020

Back Pressure Equal Channel Angular Pressing of Consolidate Pure Al Particles

Li Yinglong, He Lizi, Zhang Ling

Issue: Volume 9, Issue 1, January 2020

Pages: 1-6

Received: 11 December 2019

Published: 3 February 2020

DOI: 10.11648/j.ijmsa.20200901.11

Downloads:

Views:

Abstract: In this study, pure aluminum particles were successfully consolidated to fully dense bulk material by back pressure equal channel angular pressing (BE-ECAP) at room temperature, the evolutions of microstructure and densification mechanism were systematically investigated using an FEI-TECNAI G20 transmission electron microscope (TEM) operating at 20... Show More

Download PDF

View Online
Effect of Acid Etching Time and Concentration on Oxygen Content of Powder on the Microstructure and Elastic Properties of Silicon Carbide Densified by SPS

Zeynep Ayguzer Yasar, Richard Haber

Issue: Volume 9, Issue 1, January 2020

Pages: 7-13

Received: 27 January 2020

Accepted: 12 February 2020

Published: 28 February 2020

DOI: 10.11648/j.ijmsa.20200901.12

Downloads:

Views:

Abstract: In this current paper, oxygen content of a fine particle size SiC (H. C. Starck UF 25 Silicon Carbide) and coarser particle size SiC (Saint Gobain Silicon Carbide) were modified by using different concentrations of HF for etching. Fully dense silicon carbide ceramics (>99% th. density) were produced by the spark plasma sintering technique at 1950 °... Show More

Download PDF

View Online
Investigation of the Airborne Molecular Contamination Behavior in 300 mm Semiconductor Front - End Manufacturing

Peter Franze, Germar Schneider, Clara Zaengle, Markus Pfeffer, Stefan Kaskel

Issue: Volume 9, Issue 1, January 2020

Pages: 14-24

Received: 6 January 2020

Accepted: 15 January 2020

Published: 6 March 2020

DOI: 10.11648/j.ijmsa.20200901.13

Downloads:

Views:

Abstract: Front-end manufacturing of power semiconductor devices requires numerous different processes and materials. To control the complexity of fully automated 300 mm manufacturing lines, which typically utilize closed wafer containers, so called FOUPs (Front Opening Unified Pod), a systematic FOUP management concept is mandatory. This concept has to fulf... Show More

Download PDF

View Online