Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging

Jia Jin-Hao; Bai Shu-Xin; Xiong De-Gan; Chang Jin; Gao Ming-Qi

doi:doi:10.11648/j.ijmsa.20160502.18

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Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging

Jia Jin-Hao, Bai Shu-Xin, Xiong De-Gan, Chang Jin, Gao Ming-Qi

Published in International Journal of Materials Science and Applications (Volume 5, Issue 2)

Received: 22 April 2016 Published: 4 May 2016

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Abstract

The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm³), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10⁻⁶K⁻¹) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.

Published in	International Journal of Materials Science and Applications (Volume 5, Issue 2)
DOI	10.11648/j.ijmsa.20160502.18
Page(s)	84-88
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2016. Published by Science Publishing Group

Keywords

Cu/W85Cu/Cu Composites, Braze, Electronic Packaging

References

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[7]	WU Huabo. Research of tungsten skeleton for infiltrate copper [D]. Changsha:Central South University. Schools of Material Science and Engineering, 2009: 34–40.
[8]	G Jiang, L Diao, K Kuang. Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies [M]. Springer New York, 2013: 73-87.
[9]	Jinbin Lu, Yunchao Mua, Xiangwei Luo. A new method for soldering particle-reinforced aluminum metal matrix composites [J]. Materials Science and Engineering B, 2012, 177: 1759– 1763.
[10]	Zhao Pei, Guo Shibin, Liu, Guanghua1, Li Jiangtao. Fabrication of Cu-riched W-Cu composites by combustion synthesis and melt-infiltration in ultrahigh-gravity field [J]. Journal of Nuclear Materials. 2013, 441: 343-347.
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APA Style

Jia Jin-Hao, Bai Shu-Xin, Xiong De-Gan, Chang Jin, Gao Ming-Qi. (2016). Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. International Journal of Materials Science and Applications, 5(2), 84-88. https://doi.org/10.11648/j.ijmsa.20160502.18

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ACS Style

Jia Jin-Hao; Bai Shu-Xin; Xiong De-Gan; Chang Jin; Gao Ming-Qi. Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. Int. J. Mater. Sci. Appl. 2016, 5(2), 84-88. doi: 10.11648/j.ijmsa.20160502.18

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AMA Style

Jia Jin-Hao, Bai Shu-Xin, Xiong De-Gan, Chang Jin, Gao Ming-Qi. Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. Int J Mater Sci Appl. 2016;5(2):84-88. doi: 10.11648/j.ijmsa.20160502.18

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@article{10.11648/j.ijmsa.20160502.18,
  author = {Jia Jin-Hao and Bai Shu-Xin and Xiong De-Gan and Chang Jin and Gao Ming-Qi},
  title = {Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging},
  journal = {International Journal of Materials Science and Applications},
  volume = {5},
  number = {2},
  pages = {84-88},
  doi = {10.11648/j.ijmsa.20160502.18},
  url = {https://doi.org/10.11648/j.ijmsa.20160502.18},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20160502.18},
  abstract = {The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm3), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10−6K−1) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.},
 year = {2016}
}

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TY  - JOUR
T1  - Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging
AU  - Jia Jin-Hao
AU  - Bai Shu-Xin
AU  - Xiong De-Gan
AU  - Chang Jin
AU  - Gao Ming-Qi
Y1  - 2016/05/04
PY  - 2016
N1  - https://doi.org/10.11648/j.ijmsa.20160502.18
DO  - 10.11648/j.ijmsa.20160502.18
T2  - International Journal of Materials Science and Applications
JF  - International Journal of Materials Science and Applications
JO  - International Journal of Materials Science and Applications
SP  - 84
EP  - 88
PB  - Science Publishing Group
SN  - 2327-2643
UR  - https://doi.org/10.11648/j.ijmsa.20160502.18
AB  - The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm3), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10−6K−1) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.
VL  - 5
IS  - 2
ER  -

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Author Information

Jia Jin-Hao

College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
Bai Shu-Xin

College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
Xiong De-Gan

College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
Chang Jin

College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China
Gao Ming-Qi

College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, China

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Plain Text BibTeX RIS

APA Style

Jia Jin-Hao, Bai Shu-Xin, Xiong De-Gan, Chang Jin, Gao Ming-Qi. (2016). Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. International Journal of Materials Science and Applications, 5(2), 84-88. https://doi.org/10.11648/j.ijmsa.20160502.18

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ACS Style

Jia Jin-Hao; Bai Shu-Xin; Xiong De-Gan; Chang Jin; Gao Ming-Qi. Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. Int. J. Mater. Sci. Appl. 2016, 5(2), 84-88. doi: 10.11648/j.ijmsa.20160502.18

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AMA Style

Jia Jin-Hao, Bai Shu-Xin, Xiong De-Gan, Chang Jin, Gao Ming-Qi. Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging. Int J Mater Sci Appl. 2016;5(2):84-88. doi: 10.11648/j.ijmsa.20160502.18

Copy | Download

@article{10.11648/j.ijmsa.20160502.18,
  author = {Jia Jin-Hao and Bai Shu-Xin and Xiong De-Gan and Chang Jin and Gao Ming-Qi},
  title = {Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging},
  journal = {International Journal of Materials Science and Applications},
  volume = {5},
  number = {2},
  pages = {84-88},
  doi = {10.11648/j.ijmsa.20160502.18},
  url = {https://doi.org/10.11648/j.ijmsa.20160502.18},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20160502.18},
  abstract = {The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm3), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10−6K−1) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.},
 year = {2016}
}

Copy | Download

TY  - JOUR
T1  - Microstructure and Properties of Cu/W85Cu/Cu Composites for Electronic Packaging
AU  - Jia Jin-Hao
AU  - Bai Shu-Xin
AU  - Xiong De-Gan
AU  - Chang Jin
AU  - Gao Ming-Qi
Y1  - 2016/05/04
PY  - 2016
N1  - https://doi.org/10.11648/j.ijmsa.20160502.18
DO  - 10.11648/j.ijmsa.20160502.18
T2  - International Journal of Materials Science and Applications
JF  - International Journal of Materials Science and Applications
JO  - International Journal of Materials Science and Applications
SP  - 84
EP  - 88
PB  - Science Publishing Group
SN  - 2327-2643
UR  - https://doi.org/10.11648/j.ijmsa.20160502.18
AB  - The Cu/W85Cu/Cu composite was fabricated by pressureless infiltration and brazing method successfully. The microstructure and physical properties of Cu/W85Cu/Cu composites were investigated. The results show the interfacial region of Cu/W85Cu/Cu composites was consisted of Cu substrate, Cu–BAgCu28 interfacial layer, BAgCu28 layer, BAgCu28-Ni interfacial layer and W85Cu composite. Moreover, the interfacial microstructures investigated by SEM shows that that the electroplated Ni on the surface of W85Cu composites can improve the fillers wettability of the W85Cu composites. Further investigation reveals that the Cu/W85Cu/Cu composites possess relative low density (13.88g/cm3), excellent thermal management function as a result of high thermal conductivity up to 288.68 W/(m•K) and low coefficient of thermal expansion (7.55×10−6K−1) at room temperature. The above properties of composites successfully meet the requirement of electronic packaging. The shear strength test analysis shows that the Cu, filler (BAg72Cu), and electroplated Ni layer and W85Cu realized metallurgically joining.
VL  - 5
IS  - 2
ER  -

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