Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation

Atuman Samaila Joel; Usman Aliyu El-Nafaty; Yusuf Isah Makarfi; Jibril Mohammed; Nuhu Mamman Musa

doi:doi:10.11648/j.ijimse.20170205.11

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Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation

Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa

Published in International Journal of Industrial and Manufacturing Systems Engineering (Volume 2, Issue 5)

Received: 3 September 2017 Accepted: 21 September 2017 Published: 2 November 2017

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Abstract

Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.

Published in	International Journal of Industrial and Manufacturing Systems Engineering (Volume 2, Issue 5)
DOI	10.11648/j.ijimse.20170205.11
Page(s)	48-56
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2017. Published by Science Publishing Group

Keywords

Fin Geometry, Fin Cooling, Computer Microchips, Heat Transfer, Heatsink

References

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[2]	Kenan, Y., Nihal, A., Isak, K, and Cafer, C. (2006) “Experimental investigation of thermal resistance of a heat sink with hexagonal fins” Applied Thermal Engineering, vol 26, pp 2262-2271.
[3]	Tuckerman, D. B. and Pease, R. F. W., High-performance heat sinking for VLSI, IEEE Electron Device Letters, 1981
[4]	Intel, 2007. Intel^® Celeron^® Processor 200^Δ Sequence: Thermal and mechanical design guidelines, October, 2007. http://www.intel.com/assets/pdf/designguide/318548.pdf (Accessed December, 2015).
[5]	Chassis Plan Ltd. Cooling and noise in industrial and military computer systems http://www.chassis-plans.com/whitepapers/cooling-and-noise/ (Accessed December, 2015).
[6]	Intel, 2010. Intel^® Atom^™ Processor N450, D410 and D510 for Embedded Applications: Thermal design guide February 2010. http://www.intel.co.uk/content/dam/www/public/us/en/documents/design-guides/atom-n450-n410-d510-thermal-guide.pdf (Accessed December, 2015).
[7]	Xiaolong, Z., Yi F., Johan, Teng, W, and Zhaonium, C. (2007) “A Study of CFD Simulation for On-Chip Cooling with “D CNT Micro Fin Array” IEEE 1-4244-1253-6.
[8]	Khan WA, Culham RJ, Yovanovich MM. Analytical model for convection heat transfer from tube banks. J Thermophys Heat Transfer 2006; 20: 720-7.
[9]	Czylwik, A. Matlab for Communications, http://nts.uni-duisburg-essen.de/downloads/matlab/MatlabSeminar_main.pdf (accessed on 05/2016).
[10]	Rajput, R. K. (2008). “Heat and Mass Transfer” S. Chand & Company Ltd. Pp 205-245 Ram Nagar, New Delhi.
[11]	Incropera, P. F (1996). “Fundamentals of heat and mass transfer” John Wiley & Sons Inc. Pp 110- 127, 377-383. New York.
[12]	Mills, F. A (1997). “Heat and Mass Transfer”. IRWIN Publishers Pp 80-101. Chicago.
[13]	Robert H. P; Green, W.D. “Chemical Engineer’s Handbook” seventh edition, McGraw-Hill company.
[14]	Marlin R. V, (1995) “Liquid Cooling Performance for a 3-D Multichip Module and Miniature Heat Sink.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol 18, pp 68-73.

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APA Style

Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. (2017). Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. International Journal of Industrial and Manufacturing Systems Engineering, 2(5), 48-56. https://doi.org/10.11648/j.ijimse.20170205.11

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ACS Style

Atuman Samaila Joel; Usman Aliyu El-Nafaty; Yusuf Isah Makarfi; Jibril Mohammed; Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int. J. Ind. Manuf. Syst. Eng. 2017, 2(5), 48-56. doi: 10.11648/j.ijimse.20170205.11

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AMA Style

Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int J Ind Manuf Syst Eng. 2017;2(5):48-56. doi: 10.11648/j.ijimse.20170205.11

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@article{10.11648/j.ijimse.20170205.11,
  author = {Atuman Samaila Joel and Usman Aliyu El-Nafaty and Yusuf Isah Makarfi and Jibril Mohammed and Nuhu Mamman Musa},
  title = {Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation},
  journal = {International Journal of Industrial and Manufacturing Systems Engineering},
  volume = {2},
  number = {5},
  pages = {48-56},
  doi = {10.11648/j.ijimse.20170205.11},
  url = {https://doi.org/10.11648/j.ijimse.20170205.11},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijimse.20170205.11},
  abstract = {Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.},
 year = {2017}
}

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TY  - JOUR
T1  - Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation
AU  - Atuman Samaila Joel
AU  - Usman Aliyu El-Nafaty
AU  - Yusuf Isah Makarfi
AU  - Jibril Mohammed
AU  - Nuhu Mamman Musa
Y1  - 2017/11/02
PY  - 2017
N1  - https://doi.org/10.11648/j.ijimse.20170205.11
DO  - 10.11648/j.ijimse.20170205.11
T2  - International Journal of Industrial and Manufacturing Systems Engineering
JF  - International Journal of Industrial and Manufacturing Systems Engineering
JO  - International Journal of Industrial and Manufacturing Systems Engineering
SP  - 48
EP  - 56
PB  - Science Publishing Group
SN  - 2575-3142
UR  - https://doi.org/10.11648/j.ijimse.20170205.11
AB  - Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.
VL  - 2
IS  - 5
ER  -

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Author Information

Atuman Samaila Joel

Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria
Usman Aliyu El-Nafaty

Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria
Yusuf Isah Makarfi

Department Chemical Engineering, Durban University of Technology, Durban, Republic of South Africa
Jibril Mohammed

Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria
Nuhu Mamman Musa

Department of Chemical Engineering, Faculty of Engineering, Abubakar Tafawa Balewa University, Bauchi, Nigeria

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APA Style

Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. (2017). Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. International Journal of Industrial and Manufacturing Systems Engineering, 2(5), 48-56. https://doi.org/10.11648/j.ijimse.20170205.11

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ACS Style

Atuman Samaila Joel; Usman Aliyu El-Nafaty; Yusuf Isah Makarfi; Jibril Mohammed; Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int. J. Ind. Manuf. Syst. Eng. 2017, 2(5), 48-56. doi: 10.11648/j.ijimse.20170205.11

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AMA Style

Atuman Samaila Joel, Usman Aliyu El-Nafaty, Yusuf Isah Makarfi, Jibril Mohammed, Nuhu Mamman Musa. Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation. Int J Ind Manuf Syst Eng. 2017;2(5):48-56. doi: 10.11648/j.ijimse.20170205.11

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@article{10.11648/j.ijimse.20170205.11,
  author = {Atuman Samaila Joel and Usman Aliyu El-Nafaty and Yusuf Isah Makarfi and Jibril Mohammed and Nuhu Mamman Musa},
  title = {Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation},
  journal = {International Journal of Industrial and Manufacturing Systems Engineering},
  volume = {2},
  number = {5},
  pages = {48-56},
  doi = {10.11648/j.ijimse.20170205.11},
  url = {https://doi.org/10.11648/j.ijimse.20170205.11},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijimse.20170205.11},
  abstract = {Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.},
 year = {2017}
}

Copy | Download

TY  - JOUR
T1  - Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation
AU  - Atuman Samaila Joel
AU  - Usman Aliyu El-Nafaty
AU  - Yusuf Isah Makarfi
AU  - Jibril Mohammed
AU  - Nuhu Mamman Musa
Y1  - 2017/11/02
PY  - 2017
N1  - https://doi.org/10.11648/j.ijimse.20170205.11
DO  - 10.11648/j.ijimse.20170205.11
T2  - International Journal of Industrial and Manufacturing Systems Engineering
JF  - International Journal of Industrial and Manufacturing Systems Engineering
JO  - International Journal of Industrial and Manufacturing Systems Engineering
SP  - 48
EP  - 56
PB  - Science Publishing Group
SN  - 2575-3142
UR  - https://doi.org/10.11648/j.ijimse.20170205.11
AB  - Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.
VL  - 2
IS  - 5
ER  -

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