Research Article | | Peer-Reviewed

Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance

Received: 4 May 2026     Accepted: 25 May 2026     Published: 20 September 2026
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Abstract

Power electronic inverters are widely used in electric vehicles, renewable energy systems, industrial automation, and smart power applications due to their high efficiency and fast switching capabilities. However, the performance and reliability of these inverters are significantly affected by temperature variations, especially within semiconductor switching devices such as insulated-gate bipolar transistors (IGBTs). Excessive operating temperature can lead to increased power losses, reduced efficiency, accelerated component degradation, and eventual system failure. Therefore, accurate thermal modelling and effective temperature management are essential for improving inverter performance and operational lifespan.This research focuses on the modelling, simulation, and implementation of a temperature-influenced inverter performance framework aimed at enhancing the thermal reliability and efficiency of inverter systems. The study employs a multi-domain electro-thermal modelling approach that combines analytical power loss calculations, zero-dimensional (0D) thermal network modelling, and finite element analysis (FEA) to evaluate the thermal behavior of inverter components under varying operating conditions. A high-fidelity Digital Twin model is also developed to enable real-time thermal monitoring and predictive analysis of inverter performance.To validate the proposed framework, practical hardware implementation and experimental measurements were carried out, and the obtained results were compared with simulation outputs. The results showed close agreement between simulated and experimental data with minimal deviation, confirming the accuracy and effectiveness of the developed models. The study further demonstrates that proactive thermal management significantly improves inverter efficiency, reduces thermal stress on semiconductor devices, and enhances system reliability. The proposed methodology therefore provides an effective solution for the design and optimization of next-generation temperature-aware intelligent inverter systems.

Published in Automation, Control and Intelligent Systems (Volume 14, Issue 2)
DOI 10.11648/j.acis.20261402.11
Page(s) 29-36
Creative Commons

This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.

Copyright

Copyright © The Author(s), 2026. Published by Science Publishing Group

Keywords

IGBT(Insulated GateBipolarTransistor), High-Power Density, Power Loss Calculation, Junction Temperature Estimation, Semiconductor Reliability, Digital Twin

References
[1] J. Zhang, H. Shen, H. Sun, and Z. Wang, “Review on the Thermal Models Applications in the Reliability of Power Semiconductor Device,” Jan. 01, 2025, John Wiley and Sons Inc.
[2] L. Radomsky and R. Mallwitz, “Review, Comprehensive Analysis and Derivation of Analytical Power Loss Calculation Equations for Two- to Three-Level Midpoint Clamped Inverter Topologies with Hybrid Switch Configurations,” Sep. 01, 2023, Multidisciplinary Digital Publishing Institute (MDPI).
[3] M. Belguith, S. Eloued, M. Kadi, J. Ben Hadj Slama, and M. Hamouda, “A Review of Thermal Management Techniques Adopted for High-Power-Density GaN-Based Converters,” Mar. 01, 2026, Multidisciplinary Digital Publishing Institute (MDPI).
[4] S. Dhangar, “EVALUATION OF LOSSES IN VOLTAGE SOURCE INVERTER USING PWM TECHNIQUES FED WITH INDUCTION MOTOR DRIVE,” 2024.[Online]. Available:
[5] A. H. Okilly et al., “Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter,” Machines, vol. 11, no. 11, Nov. 2023,
[6] I. Grgić, D. Vukadinović, M. Bašić, and M. Bubalo, “Calculation of semiconductor power losses of a three-phase quasi-Z-source inverter,” Electronics (Switzerland), vol. 9, no. 10, pp. 1–20, Oct. 2020,
[7] J. Marek, A. Chvála, D. Donoval, P. Príbytný, M. Molnár, and M. Mikolášek, “Compact model of power MOSFET with temperature dependent Cauer RC network for more accurate thermal simulations,” Solid. State. Electron., vol. 94, pp. 44–50, Apr. 2014,
[8] K. Sado, J. Peskar, S. Ionita, J. Hannum, A. Downey, and K. Booth, “Real-time Electro-thermal Simulations for Power Electronic Converters.”
[9] Y. Lee, A. Castellazzi, and S. Domae, “Digital Functional Blocks Implementation of PWM and Control for a High-Frequency Interleaved Y-Inverter Motor Drive,” Electronics (Switzerland), vol. 13, no. 13, Jul. 2024,
[10] X. Li et al., “Em-electrothermal analysis of semiconductor power modules,” IEEE Trans. Compon. Packaging Manuf. Technol., vol. 9, no. 8, pp. 1495–1503, 2019,
[11] M. Shahjalal et al., “Thermal analysis of Si-IGBT based power electronic modules in 50kW traction inverter application,” e-Prime - Advances in Electrical Engineering, Electronics and Energy, vol. 3, Mar. 2023,
[12] N. Mazaheri and A. Mwesigye, “On the thermal management of drive inverter modules: energy-efficient heat sink design using topology optimization for cooling high heat flux power electronics,” Appl. Therm. Eng., vol. 280, Dec. 2025,
[13] T. An, Y. Tian, F. Qin, Y. Dai, Y. Gong, and P. Chen, “Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions,” Journal of Power Electronics, vol. 22, no. 9, pp. 1561–1575, Sep. 2022,
[14] S. Ress, G. Farkas, and M. Rencz, “Analytical Prediction of the Thermal Behavior of Semiconductor Power Devices from Room-Temperature I–V Measurements †,” Energies, vol. 17, no. 12, Jun. 2024,
[15] M. Tajwar, R. Bihani, P. Saha, and M. A. Hannan, “Tahmid Orville.”[Online]. Available:
Cite This Article
  • APA Style

    Ihennacho, G. C., Samuel, D. R., Osueke, C. O., Emeng, E. E., Jane, A. C. (2026). Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance. Automation, Control and Intelligent Systems, 14(2), 29-36. https://doi.org/10.11648/j.acis.20261402.11

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    ACS Style

    Ihennacho, G. C.; Samuel, D. R.; Osueke, C. O.; Emeng, E. E.; Jane, A. C. Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance. Autom. Control Intell. Syst. 2026, 14(2), 29-36. doi: 10.11648/j.acis.20261402.11

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    AMA Style

    Ihennacho GC, Samuel DR, Osueke CO, Emeng EE, Jane AC. Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance. Autom Control Intell Syst. 2026;14(2):29-36. doi: 10.11648/j.acis.20261402.11

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  • @article{10.11648/j.acis.20261402.11,
      author = {George Chikwendu Ihennacho and Diarah Reuben Samuel and Christian Okechukwu Osueke and Evoh Edwin Emeng and Ajaegbu Chioma Jane},
      title = {Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance},
      journal = {Automation, Control and Intelligent Systems},
      volume = {14},
      number = {2},
      pages = {29-36},
      doi = {10.11648/j.acis.20261402.11},
      url = {https://doi.org/10.11648/j.acis.20261402.11},
      eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.acis.20261402.11},
      abstract = {Power electronic inverters are widely used in electric vehicles, renewable energy systems, industrial automation, and smart power applications due to their high efficiency and fast switching capabilities. However, the performance and reliability of these inverters are significantly affected by temperature variations, especially within semiconductor switching devices such as insulated-gate bipolar transistors (IGBTs). Excessive operating temperature can lead to increased power losses, reduced efficiency, accelerated component degradation, and eventual system failure. Therefore, accurate thermal modelling and effective temperature management are essential for improving inverter performance and operational lifespan.This research focuses on the modelling, simulation, and implementation of a temperature-influenced inverter performance framework aimed at enhancing the thermal reliability and efficiency of inverter systems. The study employs a multi-domain electro-thermal modelling approach that combines analytical power loss calculations, zero-dimensional (0D) thermal network modelling, and finite element analysis (FEA) to evaluate the thermal behavior of inverter components under varying operating conditions. A high-fidelity Digital Twin model is also developed to enable real-time thermal monitoring and predictive analysis of inverter performance.To validate the proposed framework, practical hardware implementation and experimental measurements were carried out, and the obtained results were compared with simulation outputs. The results showed close agreement between simulated and experimental data with minimal deviation, confirming the accuracy and effectiveness of the developed models. The study further demonstrates that proactive thermal management significantly improves inverter efficiency, reduces thermal stress on semiconductor devices, and enhances system reliability. The proposed methodology therefore provides an effective solution for the design and optimization of next-generation temperature-aware intelligent inverter systems.},
     year = {2026}
    }
    

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  • TY  - JOUR
    T1  - Modelling, Simulation and Implementation of Temperature-Influenced Inverter Performance
    AU  - George Chikwendu Ihennacho
    AU  - Diarah Reuben Samuel
    AU  - Christian Okechukwu Osueke
    AU  - Evoh Edwin Emeng
    AU  - Ajaegbu Chioma Jane
    Y1  - 2026/09/20
    PY  - 2026
    N1  - https://doi.org/10.11648/j.acis.20261402.11
    DO  - 10.11648/j.acis.20261402.11
    T2  - Automation, Control and Intelligent Systems
    JF  - Automation, Control and Intelligent Systems
    JO  - Automation, Control and Intelligent Systems
    SP  - 29
    EP  - 36
    PB  - Science Publishing Group
    SN  - 2328-5591
    UR  - https://doi.org/10.11648/j.acis.20261402.11
    AB  - Power electronic inverters are widely used in electric vehicles, renewable energy systems, industrial automation, and smart power applications due to their high efficiency and fast switching capabilities. However, the performance and reliability of these inverters are significantly affected by temperature variations, especially within semiconductor switching devices such as insulated-gate bipolar transistors (IGBTs). Excessive operating temperature can lead to increased power losses, reduced efficiency, accelerated component degradation, and eventual system failure. Therefore, accurate thermal modelling and effective temperature management are essential for improving inverter performance and operational lifespan.This research focuses on the modelling, simulation, and implementation of a temperature-influenced inverter performance framework aimed at enhancing the thermal reliability and efficiency of inverter systems. The study employs a multi-domain electro-thermal modelling approach that combines analytical power loss calculations, zero-dimensional (0D) thermal network modelling, and finite element analysis (FEA) to evaluate the thermal behavior of inverter components under varying operating conditions. A high-fidelity Digital Twin model is also developed to enable real-time thermal monitoring and predictive analysis of inverter performance.To validate the proposed framework, practical hardware implementation and experimental measurements were carried out, and the obtained results were compared with simulation outputs. The results showed close agreement between simulated and experimental data with minimal deviation, confirming the accuracy and effectiveness of the developed models. The study further demonstrates that proactive thermal management significantly improves inverter efficiency, reduces thermal stress on semiconductor devices, and enhances system reliability. The proposed methodology therefore provides an effective solution for the design and optimization of next-generation temperature-aware intelligent inverter systems.
    VL  - 14
    IS  - 2
    ER  - 

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